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Substrate ceramic - Celcor®
The Corning Ceramic Substrates are developed for a variety of applications. It features honeycomb-like structures with thousands of parallel channels. The walls of these channels...
Substrate ceramic - Celcor®
The Corning Ceramic Substrates are developed for a variety of applications. It features honeycomb-like structures with thousands of parallel channels. The walls of these channels provide the surface for precious-metal catalysts that convert noxious emissions into carbon dioxide, nitrogen and water vapor. Some of it's distinguished features are High surface area, Low pressure drop, Rapid light-off, Thermal-mechanical durability, System cost efficiency. A truly cost effective option to meet the standards set by today's market. A definite must have for vehicle manufacturers to meet today's emission requirements. So acquire one now and experience quality, reliability and versatility only found with corning.
PLCC socket - 8400 series
3M™ Chip Carrier Sockets, 8400 Series features open-top design that promotes airflow and...
PLCC socket - 8400 series
3M™ Chip Carrier Sockets, 8400 Series features open-top design that promotes airflow and molded slots to facilitate device extraction. May be used with automated loading equipment, and accepts JEDEC chip carriers (MO-047 for square and MO-052 forrectangular). Compatible with wave solder (reflow soldering not suitable). Chip carrier sockets are RoHS-compliant.
Integrated circuit socket - 1 A
· Accepts JEDEC leadless ceramic chip carriers
· Variety of lid options available only for 68 position
· "U"...
· Variety of lid options available only for 68 position
· "U"...
Integrated circuit socket - 1 A
· Accepts JEDEC leadless ceramic chip carriers
· Variety of lid options available only for 68 position
· "U"...
· Variety of lid options available only for 68 position
· "U"...
